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MikroElektronika & FTDI Chip Introduce Multi-Faceted FT90X MCU Development Platform

FTDI Chip technology partner MikroElektronika has announced the release of a complete ecosystem of...

PCIe® Design and Test Solution Guide Addresses Interoperability and Backward Compatibility Challenges

A new document from Keysight Technologies provides thorough PCI Express® design characterization and validation...

Technical Drawings Released by Leader Tech

Leader Tech announces the public release of technical drawings for the company's full line...

York EMC Services celebrates official opening of accredited Laboratory in Scotland

York EMC Services (YES) unveiled its brand new compliance laboratory in Grangemouth, Scotland during...

TÜV SÜD explains process maturity according to the new ISO 9001

The final version of the revised standard for quality management systems is scheduled for...
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Intertek partners with Rohde & Schwarz to expand their LTE/4G operator test plan coverage

Intertek, a leading quality solutions provider to industries worldwide and a globally accredited testing laboratory...

Electronic Backpacks Turn Beetles into Rescue Cyborgs

A team of engineers developed cyborg beetles that are a potential alternative to remote...

Effective EMI Shielding via Graphene

Europe’s Graphene Flagship is a consortium of academic and industrial partners working together with...

March 26th in D.C.: TIA to Examine Technology and Policy Challenges Facing Internet of Things

With everything from e-health to transportation being revolutionized as billions of formerly dormant devices...

Heat Shrink Tubing Used in Transmission, Distribution and Insulation Protection

Amphenol Industrial Products Group, a global leader in interconnect systems, has introduced a new...
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