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Automotive

ESD Designers’ Headache with Multiple Automotive Test Requirements, Part 2

The trend of progressively migrating both ESD and EMC immunity from the system/board to the component level is creating unprecedented challenges for the component ESD designer.

Questions to Ask when Purchasing a 4-quadrant Amplifier System

The testing of automotive electronic systems requires a sophisticated highspeed 4-quadrant amplifier. Many EMC...

ESD Designers’ Headache with Multiple Automotive Test Requirements, Part I

The trend of progressively migrating both ESD and EMC immunity from the system/board to the component level is creating unprecedented challenges for the component ESD designer.

Troubleshooting Intra-System EMI

Many individual components in electrical and electronic systems and devices are integrated into systems that are required to function as a whole. Examples of such systems include large electric vehicles, fixed industrial installations, novel scientific products such as quantum computers, and more. There are two EMC-related aspects to consider: intra-system EMC and inter-system EMC. This article focuses on the intra-system EMC aspect while also considering the inter-system aspect.

Automotive EMC Testing: CISPR 25, ISO 11452-2 and Equivalent Standards, Part 2

This two-part article provides an overview of current automotive EMC standards and the intricacies of chamber testing automotive systems and components.
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Automotive EMC Testing: CISPR 25, ISO 11452-2 and Equivalent Standards, Part 1

This two-part article provides an overview of current automotive EMC standards and the intricacies of chamber testing automotive systems and components.

High Voltage ESD Protection for Automotive Ethernet Applications

Ethernet solutions have been popular in industrial and computing applications for several decades but were not widely adopted in the automotive area. Automotive ethernet enables fast and robust data communication, with high flexibility in bus topologies for multiple electronic control units (ECUs).

The Impact of Tin Whisker Formation on Vehicle Electronics

Tin whiskers are small, hair-like structures that can form naturally from the surface of tin components. This article explores potential contributors to tin whisker growth, failure mechanisms that may be induced by whiskers, current testing standards and processes, and mitigation strategies, with a particular focus on the automotive industry.

The Rise of Time-Sensitive Networking (TSN) in Automobiles, Industrial Automation, and Aviation

Speed and determinism in design, made possible by time-sensitive networking (TSN) technology, is prompting the development of new TSN profiles for a multitude of applications across industry sectors. The IEEE 802.1™ Working Group of the IEEE Standards Association (IEEE SA) offers numerous TSN profiles for applications, including the automotive, manufacturing, and aviation industries.

Evolution and Analysis of EMC Specifications at a Major Automotive OEM

The history and insight into how the EMC specifications and procedures evolved at one automotive original equipment manufacturer (OEM). Other present-day OEM specifications are more similar than different mostly due to the extensive reference to international standards which these OEMs have taken part in developing (e.g., EMC committees). Knowing this history should help today’s EMC practitioners, especially those new to the discipline, gain some insight into the implementation and limitations of test procedures and when to be flexible in analyzing test results.
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