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Could This Be the Most Functional Transistor in the World?

University of Wisconsin-Madison engineers have designed the world's most functional flexible transistor, and it could soon be commercialized.

Skip Hop Recalls Nightlight Soothers Due to Shock Hazard

Skip Hop Recalls Nightlight Soothers Due to Shock Hazard

Recently Published Standard, IEC 61400-25-5:2017 for Wind Energy Generation Systems

The International Electrotechnical Commission (IEC) has released IEC 61400-25-5:2017

Newly Released IEC 61643-32:2017 for Low-Voltage Surge Protective Devices

The International Electrotechnical Commission (IEC) has released IEC 61643-32:2017

The Future Revision of ISO/IEC 17025 and its Impact on EMC and Radio Testing Laboratories

This article will summarize the major changes of the new revision of ISO/IEC 17025-2005, present the new outline of the standard and will discuss the new concept of a “risk-based” approach of implementing requirements.
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NFPA 790/791 and ISO/IEC 17020 for Field Evaluation Bodies

The purpose of this article is to provide background on FEBs and the challenges of confirming the competency of a FEB with the varying requirements from one AHJ to another.

Preparing for and Implementing Product Recalls

This article will discuss the ways in which a company can be organized and prepared to meet its post-sale duties and to undertake a field corrective action program or a recall.

Electromagnetic Compliance: A View from the Field

This article will look at what causes harmful interference and how EMC regulations address them. It will examine three typical and largely encompassing cases that can be extrapolated to many other applications.

Graphically Conveying Complex Safety Messages

As the person responsible for your product’s safety labels, you might run into this problem: you want to convey your message in “symbol-only” form because your intended audience is global and yet your safety message is fairly complex.

Statistical Sampling Comes to ESD Testing

How can we provide a quantitative measure of ESD robustness but control the rising test times while preventing major overstress and wear out from thousands of ESD strikes per IC?
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