Columns

Shielding effectiveness changes dramatically in the near field. This month's column introduces wave impedance concepts for electric and magnetic dipoles, revealing why electric sources behave as high-impedance radiators while magnetic sources act as low-impedance radiators—distinctions critical for designing effective shields close to emission sources.

High-speed automotive serial links supporting ADAS features face a critical challenge: meeting stringent system-level ESD requirements while maintaining signal integrity at 10+ Gbps. This column presents an innovative on-chip protection architecture embedding ESD clamps within T-coil circuits, achieving 8kV ISO protection while supporting data rates exceeding 36 Gbps.Retry

Discover why copper shields outperform steel at low frequencies but steel dominates at high frequencies. This practical guide presents simplified formulas for calculating electromagnetic shielding effectiveness, revealing the surprising crossover point at 4200 Hz where material performance flips.

Real-world ESD discharge currents during semiconductor assembly differ dramatically from standard test predictions. A new Discharge Current Sensor reveals that actual currents are lower but faster than expected, challenging current protection designs for Multi-Chip Modules and Systems in Package.

Part 4A of a comprehensive shielding series derives two practical approximate solutions from exact electromagnetic theory. For good, thick conductors in far-field conditions, multiple-reflection losses become negligible, significantly simplifying shielding effectiveness calculations for engineers.

Discover the exact mathematical solution for far-field shielding effectiveness of solid conducting shields. Learn how reflection, absorption, and multiple-reflection losses combine to determine a shield's ability to block electromagnetic radiation in real-world applications.

USB-C's high-speed data lines need robust ESD protection, but TVS device placement matters critically. New research reveals why positioning protection behind AC coupling capacitors—not in front—delivers superior IC protection for sensitive SuperSpeed applications.

Expensive EMC simulation software isn't always necessary for practical troubleshooting. Discover how free SPICE tools can effectively tackle filter design, validate test setups, and solve real-world EMI problems—without the steep learning curve.

This is the second of seven articles devoted to the topic of shielding to prevent electromagnetic wave radiation. This article discusses the normal incidence of a uniform plane wave on a solid conducting shield with no apertures.

Traditional Charged Device Model testing falls short for bare dies in 2.5D/3D devices. With discharge currents reaching 500 mA at just 5V, existing methods can't handle the unique challenges of testing unpackaged components. CCTLP emerges as a promising alternative for reliable low-voltage testing.