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ESD Testing

Product Insights: Charged Device Model ESD Testing

This blog explains CDM ESD testing using the field-induced (FI) method, which is important for semiconductor manufacturers. It covers building a CDM-FI tester, waveform details and verification, and qualification nuances. 

Electric Shock Stimulation for Complex Leakage Current Waveforms

Leakage or touch current tests for electrical shock protection is mandated by safety standards in the process of issuing a safety certification for various electrical products. In this article, electrical shock sensation experiments were conducted for a complex waveform composed of a combination of 60 Hz and a higher frequency sinusoidal signal.

Challenges of CDM Modeling for High-Speed Interface Devices

The behavior of ultra-high-speed interfaces is complex, involving fast-rise time waveforms and on-die transient phenomena that cause device failure at lower CDM levels.

A Brief History of Electrostatic Discharge (ESD) Testing of Electronic Products

This updated version of an article originally published in the March 2014 issue provides details on recent and current developments in the ESD testing of electronic products.

Updated Trends in Charge Device Model (CDM)

As long as integrated circuits migrate to new technologies and advances are made in packaging more integrated circuit dies into a single package, the CDM challenge is going to get harder.
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Human Body Model ESD Testing

To provide in-depth coverage of ESD testing methods, in this article, we look at another type of ESD testing based on the “Human Body Model” (HBM) method of ESD testing.

Low Voltage Charged Device Model (CDM) Testing at a Crossroads

Most ESD experts consider CDM testing to be the most critical ESD qualification test for modern integrated circuits. ESD control engineers need to know the charged device ESD robustness of all components passing through their manufacturing line. CDM measurements provide that knowledge.

What Are the Advantages of Capacitively Coupled TLP (CC-TLP)?

Within the past 18 years, many studies exploring 3 µm to 7 nm technologies have demonstrated the excellent correlation of CC-TLP with CDM in terms of stress current failure threshold as well as electrical failure and physical damage signature.

Toward Standardization of Low Impedance Contact CDM

The 16.6 ohm implementation of contact CDM (LICCDM) recently published in ANSI-ESD Standard Practice 5.3.3 is shown to produce waveforms of similar shape, Ifail, and Ipeak vs. Ceff dependency as JS-002. The non-monotonicity of JS-002 at low voltages is overcome using LICCDM. A path to joint standardization with air discharge testing is proposed.

Advances in CMOS Technologies Leading to Lower CDM Target Levels

Can you continue aiming for typical CDM protection levels? Introduction The ESD Design Window (ESD-DW) has...
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