Expert Insights

Can the hi-pot test and the insulation resistance test be combined into a single measurement? Let’s discuss each of these parameters as circuit parameters and as safety parameters.

Circuit design reliability verification in Integrated Circuit (IC) design is extremely challenging.

RF signals entering in a system and being rectified can interfere seriously. That has been classically the case of audio noise in speakers because of mobile phones using TDMA technology. The problem is now very common in products with wireless RF funcionality in products with audio areas.

This article is devoted to the current method of the conducted emissions measurements.

For production-line testing, the 25- or 30-amp grounding continuity test is not likely to identify construction anomalies that would not also be identified by a simple low-current test.

As the person responsible for your product’s safety labels, you might run into this problem: you want to convey your message in “symbol-only” form because your intended audience is global and yet your safety message is fairly complex.

How can we provide a quantitative measure of ESD robustness but control the rising test times while preventing major overstress and wear out from thousands of ESD strikes per IC?

This article focuses on the current probes used in EMC measurements and testing.

High-current grounding impedance tests have been specified in safety standards for many years. There are two, independent sources for these tests.

The charged device model describes the electrostatic discharge (ESD) event that occurs when an integrated circuit (IC) is rapidly charged or discharged through a single pin to a metallic surface.