Expert Insights

A common problem experienced by novice oscilloscope users is the inability to effectively capture signals we're trying to measure.

This is the first of three articles devoted to the design, test, and electromagnetic compatibility (EMC) immunity evaluation of multilayer PCBs containing analog circuitry. In this study, there are seven design variants that all contain a similar schematic but implement different PCB layout techniques.

Most ESD experts consider CDM testing to be the most critical ESD qualification test for modern integrated circuits. ESD control engineers need to know the charged device ESD robustness of all components passing through their manufacturing line. CDM measurements provide that knowledge.

To learn more about leadership, the author read as many leadership books as he could for one year. He planned to learn what the latest leadership best practices were and become a more effective leader at the end of it all, or at least be set up to become a better leader as time progressed.

This article presents a simple method of estimating the parasitics of the three passive circuit components (R, L, C).

The thin-film transistor (TFT) became commercially available slightly more than 30 years ago in the form of a switch for the Liquid Crystal Display.

Read an interview with Dr. Robinson for context on manuals, including the latest standards and best practices for incorporation with your product safety strategy.

If you think you’re ever going to need to use flexible RF absorber sheets to help your product pass emissions, even at some later date, it might be a good idea to have already identified and obtained the material and have characterized its insertion-loss performance.

This is the 10th and the final article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques.

This is the second of a two-part series on transmission line pulse (TLP) testing.