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ERTLRENZ Ski Boot Heat Liners Recalled due to Fire Hazard

Gorsuch Ltd has announced a recall of their Ertlrenz Trim Heat and Foam Heat ski...

Aries Electronics Announces Thermal Solutions for Test And Burn-In Socket Line

Aries Electronics, a US manufacturer of standard, programmed and custom interconnection products, burn-in and...

DSP Research Assists with Data Collection for New SAR technologies in Japan

ART-Fi is pleased to announce that DSP Research, ART-Fi customer and leader in Japanese...

Melexis Announces Evaluation Board for Software-Defined Sensor Offering

Melexis, a global microelectronics engineering company, has today introduced an evaluation board (EVB) to...

AT4 Wireless establishes its First Anechoic MIMO OTA Test Laboratory

AT4 wireless announces that it has completed the set-up of a new Laboratory for...
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Aerospace Engineers Design Espresso Machine for ISS

In SpaceX’s latest mission to resupply the International Space Station (ISS), the Dragon capsule...

In-Flight Wi-Fi Puts Planes at Risk for Cyber Attacks

A new report from the U.S. Government Accountability Office (GAO) warns that airplanes are...

Saelig Announces New Distribution Agreement with Teledyne LeCroy

Saelig Company Inc. announces that it has been appointed an authorized distributor by Teledyne LeCroy...

Jim Blaha Joins UL Sales Team

  UL LLC located in Northbrook Illinois is expanding its Consumer Technology Division. Their newest addition to...

New Joint Standard for Component Level ESD Sensitivity Testing – Charged Device Model

The ESD Association and JEDEC Solid State Technology Association announced the publication of ANSI/ESDA/JEDEC...
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