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Industry News

A Seamless Connection

TechMESH Knitted Wire gaskets from Leader Tech make reliable electrical contact between parallel metallic surfaces in broad ranging commercial and military-grade electronic enclosures. When installed between gaps, seams and openings the gaskets create a high attenuation EMI shield thereby preventing unwanted interference from leaking into the environment.

USB Technology Differentiates Mobile Designs

USB has become the universal interface for mobile applications. The USB port has evolved from a pure data portal to a means for file transfers, battery-charging, music listening and factory programming. To better support the industry's convergence into one connector, Fairchild's new USB transceiver and USB accessory detection switch bring functional enhancements without adding design complexity or increasing space and power in mobile designs.

Curtis Industries welcomes Western Regional Sales Manager

Curtis Industries is announcing the addition of Kurt Johnson as the new Western Regional...

Board Level Shield Allows Significant Airflow and Heat Dissipation of Electronic Components

MAJR Shield is an EMI/RFI Board Level Shield that allows significant airflow and heat dissipation of electronic components.  Thermally, MAJR Shield incorporates either straight honeycomb with stand-off fence mounting for convection “Chimney effect” heat dissipation or angled honeycomb for

Largest Single-Source Calibration Provider in North America

On December 31st, 2009 Sypris Test & Measurement (STM) acquired Davis Calibration, becoming the largest single-source calibration provider in North America. Their integrated operations are creating numerous advantages, including a more comprehensive service offering.

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High-Impedance Ferrite

The very high impedance, multi-turn FerriShield ferrite from Leader Tech offers a massive amount of EMI suppression in a very small 1.25 x 1.23 x 1.25 inch package.  The bisected, snap-on design offers three pass-through openings for cables with a diameter up to .203” (5,8mm).

MicroFETT MOSFET Shrinks Its Footprint for Portable Designs

Portable designers continue to look for solutions that offer higher efficiency in smaller and thinner form factors. To meet this need, Fairchild Semiconductor offers a portfolio of high performance MicroFET MOSFETs packaged in an ultra-compact and thin footprint (1.6mm x 1.6mm x 0.55mm).

TÜVRheinland to Shed Light on CE Marking and CB Scheme

TÜVRheinland® will present seminars about CE Marking and the CB Scheme at the World...

LORD Corporation Develops Thermal Conductivity Adhesive

A leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries has announced the availability of a new low modulus, high thermal conductivity adhesive.

Fairchild Semiconductor and Infineon Technologies Enter Into Compatibility Agreement for Power MOSFETs

Fairchild Semiconductor (NYSE: FCS) and Infineon Technologies, today announced a packaging partnership for their...
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