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Design

Using Multiport Connectors in High-Frequency Military and Avionics Systems

Advance military and avionics technologies must be designed to address a range of complex specifications. The use of multiport connectors can provide significant benefits compared with conventional RF/microwave cable assemblies.

High-Integrity Components in Electrical Equipment, Part II

While the selection of components in electrical equipment plays a crucial role, a sound understanding of the characteristics of safety-critical and high-integrity components can provide valuable information about the ways to advance and achieve safety goals.

Evaluation of PCB Design Options on Analog Signal RF Immunity Using a Multilayer PCB

This is the first of three articles devoted to the design, test, and electromagnetic compatibility (EMC) immunity evaluation of multilayer PCBs containing analog circuitry. In this study, there are seven design variants that all contain a similar schematic but implement different PCB layout techniques.

High-Integrity Components in Electrical Equipment, Part 1

While the selection of components in electrical equipment plays a crucial role, a sound understanding of the characteristics of safety-critical and high-integrity components can provide valuable information about the ways to advance and achieve the safety goals.

Estimating the Parasitics of Passive Circuit Components

This article presents a simple method of estimating the parasitics of the three passive circuit components (R, L, C).
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Low-Frequency Magnetic Fields in Electric Vehicles

Low-frequency magnetic fields, a type of electromagnetic disturbance commonly found in electric vehicles, can pose potential health hazards to humans and affect the operation of critical EV components. Here are some design techniques to help mitigate the problem.

Incorporating Ethical Considerations into the Design Process

Values-based engineering is essential to ensuring that innovative products are based on ethical design considerations. The IEEE’s new standard, IEEE 7000-2021, provides a roadmap to help navigate this process and to help build trust in product designs.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the 10th and the final article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques.

Characterization for ESD Design, the TLP Zoo: Part 2

This is the second of a two-part series on transmission line pulse (TLP) testing.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

We continue to focus on the AC/DC power converter board (2-layer PCB). We evaluate the implementation of several EMC countermeasures and present the conducted and radiated emissions results performed according to the CFR Title 47, Part 15, Subpart B, Class B.
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