Design

Secure facility designs often comingle ICS/ICD-705 and NSA 94-106 performance requirements creating project confusion with significant design and cost implications. This article focuses on bringing some clarity to the differences between ICS/ICD-705 design guidance and NSA 94-106 performance requirements. The related secure facility design and construction process is also reviewed.

Advance military and avionics technologies must be designed to address a range of complex specifications. The use of multiport connectors can provide significant benefits compared with conventional RF/microwave cable assemblies.

While the selection of components in electrical equipment plays a crucial role, a sound understanding of the characteristics of safety-critical and high-integrity components can provide valuable information about the ways to advance and achieve safety goals.

This is the first of three articles devoted to the design, test, and electromagnetic compatibility (EMC) immunity evaluation of multilayer PCBs containing analog circuitry. In this study, there are seven design variants that all contain a similar schematic but implement different PCB layout techniques.

While the selection of components in electrical equipment plays a crucial role, a sound understanding of the characteristics of safety-critical and high-integrity components can provide valuable information about the ways to advance and achieve the safety goals.

This article presents a simple method of estimating the parasitics of the three passive circuit components (R, L, C).

Low-frequency magnetic fields, a type of electromagnetic disturbance commonly found in electric vehicles, can pose potential health hazards to humans and affect the operation of critical EV components. Here are some design techniques to help mitigate the problem.

Values-based engineering is essential to ensuring that innovative products are based on ethical design considerations. The IEEE’s new standard, IEEE 7000-2021, provides a roadmap to help navigate this process and to help build trust in product designs.

This is the 10th and the final article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques.

This is the second of a two-part series on transmission line pulse (TLP) testing.