hot topics in esd

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.

This article explores the waveform specifications called out in the IEC 61000-4-2 standard.

Nowadays in the semiconductors industry, the bipolar transistor is massively used for various functions in modern integrated circuits (ICs) products.

This is Part 2 of an article describing the difference between the electrostatic discharge (ESD) qualification requirements for automotive and standard commercial integrated circuits.

Integrated circuits intended for automotive applications have higher electrostatic discharge (ESD) qualification requirements than those intended for commercial and consumer electronics.

This article provides a high-level overview of the Industry Council paper “Survey on Latch‑up Testing Practices and Recommendations for Improvements,” which describes the full analysis of the collected responses and lays a path for potential adaptations needed to accommodate its use in future technologies and applications.

This article introduces typical latch-up verification techniques to detect and prevent latch-up. These techniques rely on electronic design automation (EDA) tools to deliver the coverage necessary to identify and eliminate latch-up risks. 

When handling ESD-sensitive components, we must protect them from ESD damage.

The thin-film transistor (TFT) became commercially available slightly more than 30 years ago in the form of a switch for the Liquid Crystal Display.

This is the second of a two-part series on transmission line pulse (TLP) testing.