hot topics in esd

This column outlines the steps to consider when embedding ESD detection capabilities into your system and overall design flow.

This column focuses on the practical aspects of implementing embedded ESD detection. We’ll provide a step-by-step guide, discuss validation and testing methodologies, present case studies, and delve into future trends and innovations in the field.

ESD “event detectors” have been used for years in factory environments to identify and remediate ESD discharges during manufacturing. Now design engineers are embedding system-level and on-chip ESD detection technologies into their systems to analyze and recover from both factory and field ESD events.

Simple star-tree networks, as shown here for USB2, should have wide applicability for cables carrying fast signals.

During the last four decades, damage to devices from electrical overstress (EOS) has confounded both IC suppliers and customers. The Industry Council on ESD Target Levels investigated numerous EOS root causes and established a white paper on the subject, JEP174 [1].

As long as integrated circuits migrate to new technologies and advances are made in packaging more integrated circuit dies into a single package, the CDM challenge is going to get harder.

It is a common misconception that designing an IC for system-level ESD requirements simply requires an increase in the capability of the ESD cells, which are already present for safe handling ESD requirements, like Human Body Model (HBM).

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.

This article explores the waveform specifications called out in the IEC 61000-4-2 standard.

Nowadays in the semiconductors industry, the bipolar transistor is massively used for various functions in modern integrated circuits (ICs) products.