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The ESD Association Technology Roadmap

The ESDA technology roadmap is written to support and guide the daily work of ESD and latch-up experts in the worldwide industry and academia.

Challenges of CDM Modeling for High-Speed Interface Devices

The behavior of ultra-high-speed interfaces is complex, involving fast-rise time waveforms and on-die transient phenomena that cause device failure at lower CDM levels.

Integrating Embedded ESD Detection, Part 3

This column outlines the steps to consider when embedding ESD detection capabilities into your system and overall design flow.

Implementing Embedded ESD Detection, Part 2

This column focuses on the practical aspects of implementing embedded ESD detection. We’ll provide a step-by-step guide, discuss validation and testing methodologies, present case studies, and delve into future trends and innovations in the field.

Understanding Embedded On-Chip ESD Detection, Part 1

ESD “event detectors” have been used for years in factory environments to identify and remediate ESD discharges during manufacturing. Now design engineers are embedding system-level and on-chip ESD detection technologies into their systems to analyze and recover from both factory and field ESD events.
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CDE Modeling Using Star-Tree Impedance Networks for USB2 Cable

Simple star-tree networks, as shown here for USB2, should have wide applicability for cables carrying fast signals.

The Dilemma Between Customers and Suppliers on EOS Failures

During the last four decades, damage to devices from electrical overstress (EOS) has confounded both IC suppliers and customers. The Industry Council on ESD Target Levels investigated numerous EOS root causes and established a white paper on the subject, JEP174 [1].

Updated Trends in Charge Device Model (CDM)

As long as integrated circuits migrate to new technologies and advances are made in packaging more integrated circuit dies into a single package, the CDM challenge is going to get harder.

Challenges of Designing System-level ESD Protection at the IC Level, Part 2

It is a common misconception that designing an IC for system-level ESD requirements simply requires an increase in the capability of the ESD cells, which are already present for safe handling ESD requirements, like Human Body Model (HBM).

ESD Challenges in 2.5D/3D Integration

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.
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