As long as integrated circuits migrate to new technologies and advances are made in packaging more integrated circuit dies into a single package, the CDM challenge is going to get harder.
It is a common misconception that designing an IC for system-level ESD requirements simply requires an increase in the capability of the ESD cells, which are already present for safe handling ESD requirements, like Human Body Model (HBM).
2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.
This is Part 2 of an article describing the difference between the electrostatic discharge (ESD) qualification requirements for automotive and standard commercial integrated circuits.
Integrated circuits intended for automotive applications have higher electrostatic discharge (ESD) qualification requirements than those intended for commercial and consumer electronics.
This article provides a high-level overview of the Industry Council paper “Survey on Latch‑up Testing Practices and Recommendations for Improvements,” which describes the full analysis of the collected responses and lays a path for potential adaptations needed to accommodate its use in future technologies and applications.
This article introduces typical latch-up verification techniques to detect and prevent latch-up. These techniques rely on electronic design automation (EDA) tools to deliver the coverage necessary to identify and eliminate latch-up risks.