esd

Will SEED (system efficient ESD design) truly get us away from the trial and error drudgery of system level ESD design?

What is 3D Integration and what is 3D IC? If we rewind three decades, back...

ESD sensitivity data is not readily available to the public from IC suppliers to determine if a company’s ESD control program can handle its components.

System level tests on a USB3 controller with on-board protection were found to yield irreproducible failure levels. A root cause analysis was performed using a combination of gun tests, TLP tests, and SEED simulation. It was found that an inductive current distribution between protection and SoC may explain the actual failure levels. Solutions are presented for effective on-board protection of USB3 controller boards.

Updates to Past CDM Open Forum Questions

How does a standard become the “Standard”?

It is no trivial matter to properly interpret system level test results on high-speed boards. Board manufacturers (OEMs) assess the ESD robustness of their system by means of gun testing, not always in accordance with the IEC standard.

Static control methods may be tested according to industry standards, but additional process risk assessment methods are needed to assure that the static control elements have been successful in mitigating the ESD risks.

ANSI/ESD STM 11.11-2015 was developed to fulfil a need to measure static dissipative planar materials not provided for by existing ASTM resistivity measurement methods.

The Industry 4.0 IoT platform automatically becomes a reliable and dependable venue for compliance verification, eliminating the traditional way of tedious predefined period manual checks.