This blog explains CDM ESD testing using the field-induced (FI) method, which is important for semiconductor manufacturers. It covers building a CDM-FI tester, waveform details and verification, and qualification nuances.
This column focuses on the practical aspects of implementing embedded ESD detection. We’ll provide a step-by-step guide, discuss validation and testing methodologies, present case studies, and delve into future trends and innovations in the field.
The narrow ESD design window in current FinFET technologies creates a special challenge for the robust ESD design of high-speed interfaces. Smart circuit-ESD co-design can help achieve the required ESD robustness without deteriorating functional performance.
ESD “event detectors” have been used for years in factory environments to identify and remediate ESD discharges during manufacturing. Now design engineers are embedding system-level and on-chip ESD detection technologies into their systems to analyze and recover from both factory and field ESD events.