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Flexible Electronics Created with Hybrid 3-D Printing

Scientists from Harvard University's Wyss Institute for Biologically Inspired Engineering and the Air Force Research Laboratory have joined forces to create a new method for the digital design and printing of flexible electronics.

Direct Link Discovered Between Sample Quality & Valley Polarization

The Naval Research Laboratory has discovered a surprising new link between valley polarization and sample quality.

Standing Waves on Transmission Lines and VSWR Measurements

The article discusses the behavior of voltage and current waves on a transmission line with different types of loads and explains how to measure the VSWR of an antenna.

Hi-Pot Test Current, Leakage Current and Insulation Resistance

Can the hi-pot test and the insulation resistance test be combined into a single measurement? Let’s discuss each of these parameters as circuit parameters and as safety parameters.

Addressing the Global Threat of EMP Events

Maintaining the resilience of all critical infrastructure segments, including the electric grid, sensitive data centers and vital communication channels, has become a growing concern globally as electromagnetic pulse (EMP) events continue to threaten society and the operation of business and life as we know it.
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Effect of Multi-Burst Lightning Flashes on Surge Protective Devices Using MOVs

Why hasn’t multi-burst testing to simulate lightning been more widely done? And why hasn’t it made its way into standards?

UN Lithium Battery Testing

It is a dramatic understatement to say that the world of electronic devices continues to go more portable. The mantra of smaller, lighter, and faster shows itself through the myriad of devices we use as we move through our world outside of traditional work and home environments.

An Overview of Transmission Lines in Electronic Systems

This article is a brief guide to identifying and troubleshooting Signal Integrity issues.

Latch-up Electronic Design Automation Checks

Circuit design reliability verification in Integrated Circuit (IC) design is extremely challenging.

Audio Rectification and TDMA/GSM EMI

RF signals entering in a system and being rectified can interfere seriously. That has been classically the case of audio noise in speakers because of mobile phones using TDMA technology. The problem is now very common in products with wireless RF funcionality in products with audio areas.
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