Expert Insights

Spacecraft now and of the future are being controlled by EMC requirements of the past.

Before diving too deep into the nitty gritty of high frequency probing techniques, it’s imperative to understand a few basics, as described in the remaining portion of this article. The basics include probe calibration and null measurements and a description of the various types of voltage probes available, including their strengths and weaknesses.

High-power RF/microwave amplifiers are commonly used in EMC (Electromagnetic Compatibility) testing to meet radiated and conducted immunity requirements. These products can be a high overall cost, and selecting the correct models that meet your needs is imperative.

This is the second of the three articles devoted to the topic of a Smith Chart.

As long as integrated circuits migrate to new technologies and advances are made in packaging more integrated circuit dies into a single package, the CDM challenge is going to get harder.

In this column, we discuss several important features of a spectrum analyzer not covered in previous articles that are worth your consideration.

This month’s article focuses on the value of non-traditional training courses. To be clear, when referring to non-traditional training courses, what is meant is anything that is not considered a traditional program like a two- or four-year degree program, a Master’s, or Ph.D. program, etc.

Antennas come in many different types, and it can sometimes be overwhelming to decide which one fits the need the best. In the case of immunity antennas, the correct selection may be the difference of reaching field and not. The antenna is the most important part of the system. Given that the amplifiers can be the costliest part of the system, one needs to take the time to research and find the correct antenna to make the best use of the available power.

This is the first of the three articles devoted to the Smith Chart and the calculations of the input impedance to a lossless transmission line.

It is a common misconception that designing an IC for system-level ESD requirements simply requires an increase in the capability of the ESD cells, which are already present for safe handling ESD requirements, like Human Body Model (HBM).