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Custom Designed Photo-Etched Lead Frames from PEI Meet IC Manufacturers Exact Requirements

Photofabrication Engineering (PEI) has expanded its manufacturing capabilities for custom-designed, photochemically-etched surface-mount and insert-mount...

ON Semiconductor Awarded Title III Government Funding for Development of Advanced Next-Generation Star Tracker Image Sensor

ON Semiconductor has collaborated with SRI International and Ball Aerospace & Technologies Corp. to...

Giga-tronics Releases Application Guide for Replacing TWTAs with Solid State Amplifiers

Giga-tronics has announced the release of an application guide that discusses replacing traveling wave...

TIA Issues Call for Interest on New Project for Telecommunications

The Telecommunications Industry Association (TIA) TR-41.3 Engineering Committee on Analog and Digital Wireline Terminals...

Rohde & Schwarz Empowers Mobile Operators to Deliver Quality of Experience

Rohde & Schwarz, a global leader in test and measurement, has expanded its portfolio...
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New Cable Gland System Euro-Top EMC Shields from Electric Smog

The new, fourth generation of cable glands Euro-Top EMC not only prevents intrusion by...

New TDK Brochure Features EPCOS Components for Industrial Applications

TDK Corporation has published an application guide to EPCOS Components for Industrial Applications.  ...

Aeroflex Releases the TETRA Enhanced Data Service Option for the 3920 Radio Test Set

Aeroflex has  announced the release of the TETRA Enhanced Data Service (TEDS) option for...

New IEC Appliance Inlet GSP4 for Printed Circuit Boards from Schurter

Schurter has developed a new IEC C20 appliance inlet for efficient printed circuit board...

Agilent Technologies Offers New Application Note on Functional Testing of LTE User Equipment

The Solutions for LTE Design and Verification application note from Agilent Technologies explains how...
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