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This article is devoted to the current method of the conducted emissions measurements.

For production-line testing, the 25- or 30-amp grounding continuity test is not likely to identify construction anomalies that would not also be identified by a simple low-current test.

As the person responsible for your product’s safety labels, you might run into this problem: you want to convey your message in “symbol-only” form because your intended audience is global and yet your safety message is fairly complex.

How can we provide a quantitative measure of ESD robustness but control the rising test times while preventing major overstress and wear out from thousands of ESD strikes per IC?

This article focuses on the current probes used in EMC measurements and testing.

High-current grounding impedance tests have been specified in safety standards for many years. There are two, independent sources for these tests.

The charged device model describes the electrostatic discharge (ESD) event that occurs when an integrated circuit (IC) is rapidly charged or discharged through a single pin to a metallic surface.

Whenever an electronic circuit is first energized, transients occur in current and voltage waveforms. These start-up transients can affect the electrical and thermal behavior of components and circuits with serious reliability, EMI, and random effects. Try to characterize how your circuits start and stop.

This article describes the voltage method of the conducted emissions measurements.

There always seem to be questions about hi-pot testing. Maybe I can present some of those questions and their answers.