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Columns

Hot Stuff (and Warnings)

Given that this column is principally about graphical symbols and how they’re used to...

Measuring Breakdown Voltage with an ESD Simulator

Measuring high voltage breakdown has many uses including tracking down the cause of equipment...

The iNARTE Informer – August 2012

It is now time to introduce the officers and staff of RABQSA International who...

Arc Flash Safety Labeling: Avoiding 9000°C Explosions

In this column we’ll explore the kinds of safety markings designed to warn against...

How Fast Does a Charge Decay?

Associate Professor Neils Jonassen authored a bi-monthly static column that appeared in Compliance Engineering...
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GHS and Global Consistency

Today’s international marketplace demands consistency of labeling and symbols. In this article, we’ll explain...

The iNARTE Informer – July 2012

Technology transfer and moving of hardware from our New Bern, NC office to the...

Polarization – For Better or Worse

Associate Professor Neils Jonassen authored a bi-monthly static column that appeared in Compliance Engineering...

From IEC to ISO

In this column, we'll explore how symbols migrate from IEC standards into ISO standards...

Myth vs. Reality: Common-Mode Field Transfer – Coupling Between Circuit Boards and Conductive Chassis Structures

This document discusses the myth that digital circuit boards can be isolated from conductive chassis structures, explaining the reality that they are always coupled through distributed capacitance and transmission line effects.
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