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This is the third of the three tutorial articles devoted to the frequency-domain analysis of a lossless transmission line.

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.

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Between wars, political conflict, and the economy, you may feel some mornings like just...

This is the second of the three tutorial articles devoted to the frequency-domain analysis of a lossless transmission line. This article shows numerous methods of calculating the voltage, current, and input impedance at various locations on the transmission line, using the Circuit Model.

This article explores the waveform specifications called out in the IEC 61000-4-2 standard.

Although most modern RF amplifiers have a high voltage device rating against impedance mismatch, special care is needed to prevent impedance mismatch. To avoid impedance mismatch of the power amplifier, often an attenuator is also recommended to be connected between the output of the power amplifier and the flying probe.

This tutorial article is a part of the three-article series devoted to the frequency-domain analysis of a lossless transmission line.

Nowadays in the semiconductors industry, the bipolar transistor is massively used for various functions in modern integrated circuits (ICs) products.

Read a quick guide to understanding the considerations of the main label and symbol format options available to you, including pros and cons, and whether they meet the U.S. ANSI Z535.4 standards, the international ISO 3864-2 standards, or both standards.