design

Electrostatic Discharge (ESD) protection of Integrated Circuits (ICs) requires seamless discharge paths and voltage clamping along the course of the discharge, between any pins combinations on the IC.

This article describes a practical approach to the design and build of a sleeve dipole antenna mandated by a custom EMC standard.

This article examines the different parts of capacitive touch design and provides a checklist of what to look for when designing a product.

This article describes the MOV circuit design sequence for the AC mains port overvoltage protection of pluggable type A equipment.

This is the first of two articles devoted to RC snubber design. In Part I, we discuss the fundamentals of inductive switching and the need for circuit protection.

What is 3D Integration and what is 3D IC? If we rewind three decades, back...

S-parameters are very useful to evaluate, understand, and optimize the response of your filters. If you are unfamiliar with this typical tool for RF engineers, this column is for you.

Circuit design reliability verification in Integrated Circuit (IC) design is extremely challenging.

Whenever an electronic circuit is first energized, transients occur in current and voltage waveforms. These start-up transients can affect the electrical and thermal behavior of components and circuits with serious reliability, EMI, and random effects. Try to characterize how your circuits start and stop.

This article offers an understanding of what conducted emissions are, their sources and paths, how to measure for them, and how to control them at different stages of design.