New Material Cools Electronic Devices Up to 200 Degrees Celsius

A team of researchers from Georgia Tech have developed a new thermal interface material that can conduct heat 20 times better than traditional polymer materials.  Through tests, the material has been found to operate reliably up to 200 degrees Celsius.

The material was produced using a conjugated polymer, where polymer chains in nanofibers assist in the transfer of phonons and is much stronger than material that uses crystalline structures.  This new material would be applicable for many applications that require heat to be drawn away from electronic devices.

Read more about this new thermal interface material that could solve thermal management issues.