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Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This article focuses on PCB layout considerations and the design of the reference return paths for the one- and two-layer boards.

Understanding Footwear and Flooring in ESD Control

If you really want to know whether your footwear and flooring are working together, measure the resistance from the wearer via footwear and flooring to earth (ground).

Banana Skins – November 2021 (#354-357)

In the kitchen we have a radio/tape/cd and recently the tapes have been playing with very poor sound quality.

How Ferrites Are Specified for RF Performance

Ferrites are frequency dependent components used to attenuate unwanted high frequency RF signals that...

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the fifth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques.
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What Are the Advantages of Capacitively Coupled TLP (CC-TLP)?

Within the past 18 years, many studies exploring 3 µm to 7 nm technologies have demonstrated the excellent correlation of CC-TLP with CDM in terms of stress current failure threshold as well as electrical failure and physical damage signature.

Product Safety and Liability Components in Focus

Explore the key components to keep in mind for your product safety strategy – from risk assessment to safety labels and manuals – and some of the ways that they all work together to improve safety and reduce risk.

How Not to Blow Up Your Spectrum Analyzer

Spectrum analyzers are expensive pieces of equipment that should be handled with care, especially when it involves applying signals to the RF input. Some new users may not know what “care” means and how to go about ensuring the spectrum analyzer they’re using is protected from overloading and damage.

The Importance of Considering RF Suppression Techniques Early in Design

This article briefly describes why it's important to consider what RF suppression/filtering techniques will be applied to your product as early in the design process as possible.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the fourth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques.
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