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TÜVRheinland to Shed Light on CE Marking and CB Scheme

TÜVRheinland® will present seminars about CE Marking and the CB Scheme at the World...

LORD Corporation Develops Thermal Conductivity Adhesive

A leading supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics, LED and solar industries has announced the availability of a new low modulus, high thermal conductivity adhesive.

UL Standards Update: April 16-30

Underwriters Laboratories has announced the availability of the following standards, revisions and bulletins.  For additional...

Companies recall scuba regulators, computers

Two companies have issues voluntary recalls of scuba diving technology equipment that pose a...

CPSC recognizes ‘firewalled’ Conformity Assessment Bodies

The U.S. Consumer Product Safety Commission (CPSC) has voted to recognize four additional ‘firewalled’...
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EU Commission reissues corrected standards list for EMC Directive

The Commission of the European Union (EU) has issued a correct version of its...

Updated standards list published for EU’s ATEX Directive

The Commission of the European Union (EU) has published an updated list of standards...

Fairchild Semiconductor and Infineon Technologies Enter Into Compatibility Agreement for Power MOSFETs

Fairchild Semiconductor (NYSE: FCS) and Infineon Technologies, today announced a packaging partnership for their...

EM TEST Group expanding business – Acquisition of Lüthi AG

EM TEST Group continues its growth strategy with the recent acquisition of Lüthi Elektronik-Feinmechanik...

UL Standards Update: April 1-15

Underwriters Laboratories has announced the availability of the following standards, revisions and bulletins.  For additional...
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