Magazine

Most ESD experts consider CDM testing to be the most critical ESD qualification test for modern integrated circuits. ESD control engineers need to know the charged device ESD robustness of all components passing through their manufacturing line. CDM measurements provide that knowledge.

This article presents a simple method of estimating the parasitics of the three passive circuit components (R, L, C).

The thin-film transistor (TFT) became commercially available slightly more than 30 years ago in the form of a switch for the Liquid Crystal Display.

Read an interview with Dr. Robinson for context on manuals, including the latest standards and best practices for incorporation with your product safety strategy.

If you think you’re ever going to need to use flexible RF absorber sheets to help your product pass emissions, even at some later date, it might be a good idea to have already identified and obtained the material and have characterized its insertion-loss performance.

This is the 10th and the final article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques.

This is the second of a two-part series on transmission line pulse (TLP) testing.

Is it safe to use cellphones on airplanes? The real question should be: “Is it safe for passengers to use any electronic equipment on airplanes?”

The calculation of creepage and clearance distances (spacings) is one of the most important activities a product safety/compliance engineer or technician performs throughout the product development process.

We continue to focus on the AC/DC power converter board (2-layer PCB). We evaluate the implementation of several EMC countermeasures and present the conducted and radiated emissions results performed according to the CFR Title 47, Part 15, Subpart B, Class B.