November 2023

The narrow ESD design window in current FinFET technologies creates a special challenge for the robust ESD design of high-speed interfaces. Smart circuit-ESD co-design can help achieve the required ESD robustness without deteriorating functional performance.

The world of non-food consumer products has undergone significant changes over the past two decades. New technologies and online sales are the primary drivers behind the upcoming new Product Safety law.

This article presents methods for building reduced-order models (ROMs) based on proper orthogonal decomposition (POD) for modeling transient heat transfer in partially-perfuse tissue in prolonged contact with a heat-generating wearable device.

Even though warnings and instructions are not followed by all product users, they are important for product safety and product liability defensibility. Manufacturers must decide how safe to design their products and when they can also rely on warnings and instructions to make the product safe.

This is the second of a three-article series devoted to the correlation between the insertion loss and input impedance of passive EMC filters. This article focuses on π and T filters.

ESD “event detectors” have been used for years in factory environments to identify and remediate ESD discharges during manufacturing. Now design engineers are embedding system-level and on-chip ESD detection technologies into their systems to analyze and recover from both factory and field ESD events.

Conducted emission tests can provide reasonably accurate results and also serve as a reliable indicator of radiated emissions, as some of these emissions propagate through cable wiring.

Although understanding each capacitor type and behavior is daunting and difficult to memorize, it is prudent that every aspiring engineer and technician involved in design for EMC at least have a rudimentary understanding of what capacitor technologies are available.