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Hot Topics in ESD

Absence of IC ESD Sensitivity Data Has Reached a Critical Stage

ESD sensitivity data is not readily available to the public from IC suppliers to determine if a company’s ESD control program can handle its components.

ESD Open Forum

Updates to Past CDM Open Forum Questions

EOS/ESD Association, Inc. Standards Development Process

How does a standard become the “Standard”?

Charged Board Event (CBE)

Charged Board Event (CBE) is an electrostatic discharge (ESD) event that can occur on assembled printed circuit boards (PCB) and electromechanic assemblies.

Product Qualification in an ESD Control Program

Section 7.3 in ANSI/ESD S20.20–2014 includes a requirement for a product qualification plan.
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ESD Measurement Methods Affected by Manufacturing Changes

Static control methods may be tested according to industry standards, but additional process risk assessment methods are needed to assure that the static control elements have been successful in mitigating the ESD risks.

ANSI/ESD STM11.11-2015 Surface Resistance Measurements of Static Dissipative Planar Materials

ANSI/ESD STM 11.11-2015 was developed to fulfil a need to measure static dissipative planar materials not provided for by existing ASTM resistivity measurement methods.

ESD Control in the World of IoT

The Industry 4.0 IoT platform automatically becomes a reliable and dependable venue for compliance verification, eliminating the traditional way of tedious predefined period manual checks.

Latch-up Qualification

Often (very) fast transients have been proven to trigger latch-up. This kind of latch-up is called transient induced latch-up, commonly known as “transient latch-up” (TLU).

Beyond ANSI/ESD S20.20: High Reliability ESD Control Processes and Lower ESD Sensitivities

ESD process control in factories where ESD-sensitive parts are being handled is the foundation for the manufacturing of high quality electronic products.
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