Industry News

ETSI has announced the release of the first Group Report developed by its Reconfigurable Intelligent Surface Industry Specification Group. The ETSI Report ETSI GR RIS-001 identifies and defines relevant RIS use cases, with corresponding general Key Performance Indicators (KPIs).

Spectrum Control has introduced a dual line common mode panel mount EMI filter that reduces space and weight by 50% compared to two single line filters. It delivers reliable EMI filtering of common mode noise from 30 kHz to 1 GHz and differential mode noise from 30 kHz to 10 MHz.

Electrically conductive adhesive (ECA) is a revolutionary material changing the game for electronic devices. This adhesive offers unique benefits and uses that make it an essential component in high-performance electronics.

Empower RF Systems has announced their newest GaN on SiC amplifier, the model 2245. This liquid cooled amplifier delivers a minimum of 4100W CW from 2 to 4GHz with 5kW mid band performance. Reliability is a key feature and the result of its distributed RF architecture. With no single point of RF failure, the 2245 boasts extreme Effective Mean Time Before Failure (EMTBF).

HV TECHNOLOGIES, Inc., a family-owned business specializing in the distribution and servicing of HV (high voltage) and EMC (electromagnetic compatibility) test equipment, is celebrating its 25th anniversary this year.

Würth Elektronik announces support for Lake Area Technical College. The new eSports and Drone Racing...

TDK Corporation offers a new series of current-compensated EPSOC double-ring core chokes for the suppression of common-mode interferences in switch-mode power supplies, converters, and domestic appliances.

Element Materials Technology has expanded its product qualification testing (PQT) capabilities at its testing sites in Hull and Hitchin (UK) to address the broader range of wireless technology requirements.

Saelig has introduced its new JRE TVK isolation tester, designed to help verify the...

Orbel has introduced its Groove-LocTM EMI shielding material for use in printed circuit board prototyping.