ESD Workshop

• ESD Packaging considerations – Ted
Dangelmayer

There are several misunderstandings
and controversies related to ESD packaging that have had significant impact on
packaging costs and some industry standards give misleading technical
direction. For instance, one case study revealed unnecessary packaging
expenditures as high as $400,000 per year.  This tutorial will
explore similar case studies, fundamental packaging principles, available
packaging materials, and how to avoid excessive costs. You will also learn
which materials and methods provide Charged Device Model and Charged Board
Event protection and which ones introduce risk.  

Standards such as ASTM D-257 and
ANSI/ESD S541 will be discussed to highlight their strengths and requirements
to avoid. You will learn why ASTM D-257 is no longer appropriate for ESD
applications. Emphasis will be placed on shielding options including air
gap discharge shielding without a metalized layer.   

Learning Outcomes

 Attendees
will:

•      Develop
an understanding of how to develop packaging strategies to optimize performance
and reduce costs.

•      Develop
a more complete grasp of how to mitigate of Charged Device Model and Charged
Board Event damage with packaging and handling materials.

•      Come
to understand which standards to apply to packaging and which ones to avoid.

•      Understand
packaging fundamentals such as when to apply shielding and when dissipative
materials are sufficient. 

•      Learn
about the myths related to metalized shielding and advantages of air gap
discharge shielding. 

•      Learn
how to avoid unnecessary packaging expenses.