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TIA is Pioneering New Standard to Address Cybersecurity Concerns of Telecom Networks

The Telecommunications Industry Association (TIA), the leading association representing the manufacturers and suppliers of...

X-REL Semiconductor XTR54000 High-Temperature Multi-Function Logic Gates

X-REL Semiconductor has introduced its High-Temperature multi-function logic gates: XTR540. Intended for high-reliability, extreme...

GradConn Launches Low Cost Test Probe Cable Assemblies

GradConn has launched a new range of low cost co-axial test probe cable assemblies...

Vermont 911 Blackout Caused by Multiple Equipment Failures

A 40-minute blackout of Vermont’s 911 system was caused by technical glitches and blocked 83 callers from reaching the dispatch center. The disruption of service occurred on Wednesday, August 6th from 12:15 pm to 12:55 pm.

New “Biofabrication” Methodologies Being Developed

University of Maryland researchers are developing new “biofabrication” procedures that join microelectronics with biological systems. These new procedures could result in new methods to assemble devices and improve communication.

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New Edition of UL 60730-2-13 Published

A new edition of UL 60730-2-13 has been published by UL. UL 60730-2-12 is...

New Edition of IEC 60601-2-1 Published

A new edition has been published by the International Electrotechnical Commission for IEC 60601-2-1....

Empower RF Systems Announces Approval of a Patent on “Broadband linearization module and method”

Empower RF Systems is proud to announce the approval of a new patent related...

New Edition of IEC 60601-1-12 Published

A new edition has been published by the International Electrotechnical Commission for IEC 60601-1-12....

Study Finds Driverless Cars Will Not Have Steering Wheels or Gas/Brake Pedals

The Institute of Electrical Engineering (IEEE) collected the opinions of over 200 researchers, professors,...
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