testing

It is no trivial matter to properly interpret system level test results on high-speed boards. Board manufacturers (OEMs) assess the ESD robustness of their system by means of gun testing, not always in accordance with the IEC standard.

Can the hi-pot test and the insulation resistance test be combined into a single measurement? Let’s discuss each of these parameters as circuit parameters and as safety parameters.

It is a dramatic understatement to say that the world of electronic devices continues to go more portable. The mantra of smaller, lighter, and faster shows itself through the myriad of devices we use as we move through our world outside of traditional work and home environments.

For production-line testing, the 25- or 30-amp grounding continuity test is not likely to identify construction anomalies that would not also be identified by a simple low-current test.

How can we provide a quantitative measure of ESD robustness but control the rising test times while preventing major overstress and wear out from thousands of ESD strikes per IC?

This article focuses on the current probes used in EMC measurements and testing.

High-current grounding impedance tests have been specified in safety standards for many years. There are two, independent sources for these tests.

Charged device model (CDM) ESD is considered today to be the primary real world ESD model for representing ESD charging and rapid discharge and is the best representation of what can occur in automated handling equipment used in manufacturing and assembly of integrated circuits (IC) today.

The charged device model describes the electrostatic discharge (ESD) event that occurs when an integrated circuit (IC) is rapidly charged or discharged through a single pin to a metallic surface.

Transmission Line Pulse testing is the default method for characterizing the behavior of devices under ESD circumstances.