Dr. Norman Chang is an Ansys Fellow and Chief Technologist in the Semiconductor business unit at ANSYS Inc. Dr. Chang received his BS, MS, and Ph.D. in Electrical Engineering and Computer Sciences from University of California, Berkeley. He holds eighteen patents and has authored over 50 technical papers, and also co-authored the popular book Interconnect Analysis and Synthesis.
Karthik Srinivasan is a Senior Product Manager for analog and mixed signal products at the Semiconductor business unit at Aysys, Inc. His work focusses on product planning for analog/mixed signal simulation products, and has over 14 years of experience in EDA in various positions. Srinivasan’s research interest includes power estimation, power noise, reliability and thermal analysis for chip-package and system.
David Schramm has more than 20 years’ experience in medical, ITE, industrial, appliances, test and measurement, audio and regulatory wireless. He specializes in EMC, wireless and SAR testing including Wifi, Bluetooth, low power (unlicensed), short range devices and RFID. Schramm is also specialized in licensed devices, including LTE mobile phones and PTT. He sits on both ANSI C63.10 and ANSI C63.26 working groups, and has co-authored several articles, including one published in the IEEE Publication Journal.
Brett Alsop is the North America Lighting Safety Technical Lead at Intertek. He has more than 25 years’ experience in product testing and serves on many technical panels for standard writing.
Claudio Stazzone has worked as an EMC technician since 2008 and is currently serving as a Senior Project Handler at an EMC lab in Turin (Italy).
John Grant has been designing digital networks since 1981. He has created products for carrying video and audio over digital networks, including network switching equipment. He is a Fellow of the Audio Engineering Society. He is currently the Chair of ETSI ISG NIN (Non-IP Networking).
Dan Roman is a product compliance manager and iNARTE Certified Product Safety Engineer engaged in design and certification aspects of international safety, EMC, telecom, wireless, and product ecology.
Harald Gossner is Senior Principal Engineer at Intel. Harald has authored and co-authored more than 150 technical papers and two books in the field of ESD and device physics. He holds more than 70 patents on the same topics. Currently, he also serves as Senior Vice President of EOS/ESD Association, Inc. and as editor of IEEE Electron Device Letters.
Krzysztof Domanski a Principal Engineer in the field of ESD/Latchup on chip and system level at Intel.