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Testing

Contact Burn Injuries: The Influence of Object Thermal Mass

This article identifies the burn injury threshold conditions associated with finite thermal mass objects and presents a model for predicting the degree of burn injury.

Trust but Verify

It’s imperative for successful completion of a testing project that as a compliance engineer or technician leading a product certification effort, you trust but verify the work of testing facilities.

How Grounds Affect the Peak Voltage Due to Lightning

The most common characterization of ground rods actually differs from what is observed in the case of lightning. This article discusses what is observed and how that affects ground rod performance.

Advances in CMOS Technologies Leading to Lower CDM Target Levels

Can you continue aiming for typical CDM protection levels? Introduction The ESD Design Window (ESD-DW) has...

Evolution of Charged Device Model ESD Target Requirements

Historical Background  CDM is an important model for ESD qualification. The well-known CDM refers to...
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Important Considerations When Installing, Tearing Down, and Moving an EMC Chamber

You’re an expert at EMC testing but, when it comes to installing, tearing down, and moving an EMC chamber, you may not have a clear understanding of all of the non-engineering tasks that go along with such an important event.

The Development of Proficiency Testing Programme for Electrical and Mechanical Safety Tests

This article explains the development process of a proficiency testing programme that is suitable for electrical and mechanical safety tests. The process for testing the homogeneity and stability of specimens is also discussed.

Firmware: The Inexpensive Way to Address EMC Issues

Firmware is integral to the operation of most devices, and may represent an easier and less expensive pathway for addressing EMC issues. This article presents different approaches to modifying firmware as well as case studies illustrating the potential effectiveness of this approach.

Safety Outside the Box

This article discusses additional requirements that designers and safety professionals may want to consider beyond the base standard for their product based on the environment and user exposure.

Device Failure from the Initial Current Step of a CDM Discharge

CDM discharges exhibit a fast initial current step when the stray capacitance of the pogo pin is charged. It is demonstrated that the high slew rate can damage sensitive gate oxides. The miscorrelation of CDM and CC-TLP methodologies is addressed by applying pulses with 20 ps rise time.
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