Testing

Recalls can create huge problems for manufacturers and product sellers. They can generate new product liability lawsuits that are harder to defend, involve a significant financial cost to implement, and create reputational problems with consumers and retailers. Manufacturers must carefully design a recall or other corrective action that is as effective as possible and adequate under the circumstances. Various government entities are issuing new requirements that can help with these efforts.

The behavior of ultra-high-speed interfaces is complex, involving fast-rise time waveforms and on-die transient phenomena that cause device failure at lower CDM levels.

Solving EMI problems isn’t only about ensuring that a product can meet EMC regulations and standards (although it’s a significant part of the job). Another crucial reason for addressing EMI issues is to enhance product reliability, especially when a product operates in public or industrial areas where there are many different types of noise sources.

This two-part article provides a detailed overview of hardware compliance issues applicable to mainframe and server computers and their subcomponents.

This article presents a framework for assessing the measurement uncertainties on an outdoor far‑field elevated range.

This two-part article provides a detailed overview of hardware compliance issues applicable to mainframe and server computers and their subcomponents.

The trend of progressively migrating both ESD and EMC immunity from the system/board to the component level is creating unprecedented challenges for the component ESD designer.

Choosing an EMC test lab to work with is one of the most important decisions any electronics design engineer or product developer has to make.

The world of non-food consumer products has undergone significant changes over the past two decades. New technologies and online sales are the primary drivers behind the upcoming new Product Safety law.

This article presents methods for building reduced-order models (ROMs) based on proper orthogonal decomposition (POD) for modeling transient heat transfer in partially-perfuse tissue in prolonged contact with a heat-generating wearable device.