Testing

Many manufacturers believe that third-party testing is required to meet the requirements of the EU’s EMC Directive. But there are other, legally acceptable paths to demonstrate compliance with the EMC Directive that do not require the use of a third party.

This blog explains CDM ESD testing using the field-induced (FI) method, which is important for semiconductor manufacturers. It covers building a CDM-FI tester, waveform details and verification, and qualification nuances. 

Leakage or touch current tests for electrical shock protection is mandated by safety standards in the process of issuing a safety certification for various electrical products. In this article, electrical shock sensation experiments were conducted for a complex waveform composed of a combination of 60 Hz and a higher frequency sinusoidal signal.

Recalls can create huge problems for manufacturers and product sellers. They can generate new product liability lawsuits that are harder to defend, involve a significant financial cost to implement, and create reputational problems with consumers and retailers. Manufacturers must carefully design a recall or other corrective action that is as effective as possible and adequate under the circumstances. Various government entities are issuing new requirements that can help with these efforts.

The behavior of ultra-high-speed interfaces is complex, involving fast-rise time waveforms and on-die transient phenomena that cause device failure at lower CDM levels.

Solving EMI problems isn’t only about ensuring that a product can meet EMC regulations and standards (although it’s a significant part of the job). Another crucial reason for addressing EMI issues is to enhance product reliability, especially when a product operates in public or industrial areas where there are many different types of noise sources.

This two-part article provides a detailed overview of hardware compliance issues applicable to mainframe and server computers and their subcomponents.

This article presents a framework for assessing the measurement uncertainties on an outdoor far‑field elevated range.

This two-part article provides a detailed overview of hardware compliance issues applicable to mainframe and server computers and their subcomponents.

The trend of progressively migrating both ESD and EMC immunity from the system/board to the component level is creating unprecedented challenges for the component ESD designer.