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Standards and Compliance

A Historical Look Back: The 1977 CBEMA Paper on Electromagnetic Emanations: Part 2

The first part of this paper reviewed the first one-third of the report including the Title of the Paper, the Background to its development, the Members of the Subcommittee that developed the report, Definitions, Table of Contents, Scope and Section 4. This second part of the paper will look at Section 5 (Susceptibility of Communications Receivers to Commercial EDP/OE Emanations) of the Report.

How to Prepare for Possible Product Recalls

In 2011, Australia and Canada adopted new product safety laws that require manufacturers and others in the supply chain to monitor their products in use, and to report safety issues and take appropriate corrective actions in certain situations. In addition, the U.S. Consumer Product Safety Commission has become more aggressive in levying civil penalties on companies who do not report safety problems in a timely fashion.

A Historical Look Back: The 1977 CBEMA Paper on Electromagnetic Emanations

In the middle of the 1970s, the United States Federal Communications Commission (FCC) began to look seriously at electromagnetic emissions from electronic data processing (EDP) equipment and office equipment (OE). This growing awareness on the part of the United States telecommunications regulation body was a result of the increasing number of computers being used by society and the increased potential for growth by licensed broadcast services due to the proliferation of electronic-computer sources. The Computer and Business Equipment Manufacturers Association (CBEMA) formed a technical subcommittee to assist in preparing an industry response to the concerns of the FCC. This paper reviews the report developed by that technical subcommittee, made public in May of 1977.

Electrostatic Discharge Technology Roadmap

This document provides estimates of future ESD device thresholds and their potential impact on ESD control practices. The threshold estimates reflect the prevailing trends in semiconductor technology as viewed by selected industry leaders. These projections are intended to provide a view of future device protection limitations driven by performance requirements and technology scaling. It also provides a common view of expected performance for device suppliers and users. Finally, these trends point to the need for continued improvements in ESD control procedures and compliance.

Lightning Damage to Equipment without a Metallic Connection to an External Communications Service

Lightning damage to equipment with a metallic (wired) connection to a communications service has been studied for many years, resulting in a series of Telcordia GR, ATIS and TIA standards in the United States, and ITU-T recommendations elsewhere.
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Recent Changes to GR-1089-CORE

Released in May of 2011, GR-1089-CORE Issue 6 Electromagnetic Compatibility (EMC) and Electrical Safety requirements for Network Telecommunications Equipment has undergone a number of technical changes. We look at its substantial modifications and the potential impact on previously certified products.

Update on the RoHS Recast

With the recent recast of the EU’s Restriction on the use of certain Hazardous...

New Test Methods to Determine the Shielding Effectiveness of Small Enclosures Defined in IEEE P299.1

Today’s end-use electronic equipment has a number of characteristics that require protection from the electromagnetic environment. These characteristics include the growing use of digital electronics (still with a layer of analog electronics); multiple inputs and outputs for power, data, controls and indicators; ventilation for air flow and thermal management; and small openings for accessories. Few pieces of equipment use only one microprocessor. Multiple digital packages (i.e., integrated circuits) are used for small and large amounts of memory, signal processing, and input/output control just to name a few. The days of having just one power cord and a few knobs for control have long since past.

No Sleeping in Seattle: A Recap of CISPR Projects from the 74th IEC General Meeting – Part 2

In this second installment of a two part article, we continue our review of the recent meeting of IEC-CISPR held in October 2010 in Seattle. In the first part of this article, we have described the current changes affecting the basic standard CISPR 16 and the activities of its experts within CISPR sub-committee (SC) A. We now take a look at the activities of the other CISPR sub-committees responsible for preparing the CISPR product standards. We also describe some of the projects shared by CISPR and IEC TC 77B (High Frequency Phenomena).

Ready for the RoHS Recast?

A quick update on the timeline for publication - just the dates Many companies are...
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