Resources

Electrostatic discharge remains one of the most unpredictable threats in electronics design. This article uncovers how ESD simulators expose hidden vulnerabilities, reveals the most common compliance‑testing failures, and shares practical, engineering‑focused strategies to build products that can survive real‑world shocks and stay reliably in the field.

Explore how PCB via and trace geometry influence the real‑world effectiveness of decoupling capacitors. This first article in the series defines six board variants, capacitor placement strategies, and PCB topologies, setting the stage for upcoming RF emission results based on CISPR 25 testing.

This column explores two air‑discharge‑based methods for testing small form factor products under the Charged Device Model. It examines limitations of traditional FICDM testers, presents wafer‑level and bare‑die testing approaches, and introduces contact‑first CDM techniques designed to improve reliability for fine‑pitch and low‑voltage devices.

Creepage distance isn't insulation—it's the surface distance between conductors on solid insulation. Understanding how contamination causes micro-arcs, why CTI matters, and when Paschen's law applies is critical for electrical safety and proper insulation design.

Compliance isn't a final checkpoint—it's a design foundation. Integrating regulatory standards early prevents costly redesigns, accelerates certification, and ensures market approval. Discover practical strategies for building compliance into product development from day one.

Behind every successful EMC compliance test is a high-quality RF amplifier. Learn how these devices generate required field strengths, suppress unwanted harmonics, and maintain stable operation during demanding radiated immunity testing in semi-anechoic chambers.

Even perfect shields fail with poor aperture design. Learn how slot orientation, size, and placement affect shielding effectiveness, and discover why multiple small holes outperform single large openings using Babinet's principle.

FICDM testing wasn't designed for today's tiny chiplets and flip chip assemblies. Part 1 explores critical challenges: probes too large for microbumps, unreliable air discharge below 250V, and the mounting dilemma for bare die products.

Explore the future of electromagnetic compatibility and compliance engineering. From 5G and IoT to AI-driven testing and electric vehicles, discover emerging technologies, innovations, and challenges shaping EMC standards and ensuring reliable, interference-free electronic systems.

Planning an EMC test chamber? Electromagnetic compatibility (EMC) test chambers are specialized facilities for evaluating electronic devices against electromagnetic interference. This guide explores essential design considerations—including RF absorber selection, shielding materials, and chamber configuration—to help engineers create accurate, compliant testing environments that meet industry standards.