Resources

Advance your technical career in 2025 with this comprehensive guide to EMC and compliance training opportunities. From virtual seminars and on-demand courses to international conferences and symposia, discover free and affordable resources designed to enhance your professional expertise and stay current in the field.

Discover how a unique collaboration between Grand Valley State University and E3 Compliance creates exceptional learning opportunities in EMC and high-speed electronics. Learn how students gain hands-on industry experience through co-op programs, research projects, and real-world testing, preparing them for successful careers in electromagnetic compatibility.

Explore innovations in transistor scaling technology with a focus on backside power delivery networks. This technical analysis examines how extremely thinned silicon substrates impact ESD protection in advanced semiconductor devices, offering solutions for maintaining reliability in next-generation chip designs.

Discover the key sources of uncertainty in radiated emissions testing and learn how to calculate measurement uncertainty budgets. Essential insights for EMC professionals seeking more accurate and reliable test results.

Discover essential but often overlooked aspects of compliance engineering, from material selection to ethical conduct. Learn practical insights for navigating regulatory landscapes while maintaining product safety and integrity.

A revealing EMI analysis of the popular BeagleBone Black processor board uncovers concerning radiation levels and design flaws, suggesting potential challenges for industrial applications. The detailed investigation includes near-field scans, cable current measurements, and PCB design review.

Reverberation chamber testing offers major EMC advantages over traditional methods by exposing units to electromagnetic fields from multiple angles simultaneously. This approach saves time, better simulates real-world conditions, and catches vulnerabilities earlier in development.

This is the third and final article discussing four different circuit models of transmission lines in sinusoidal steady state. This article uses Model 4 to determine the locations of the minima and maxima of standing waves. This determination is first done analytically, followed by the graphical method using the Smith chart.

This column explores the significant impact of artificial intelligence on advancements in silicon fabrication, focusing on the development of high bandwidth memory (HBM) and associated die-to-die(D2D) electrostatic discharge (ESD) protection challenges.

This month's Practical Engineering explains how to use the Welch-Satterthwaite formula to calculate the effective degrees of freedom and expanded uncertainty in a measurement uncertainty analysis. It provides a practical example to demonstrate the application of this formula.