Expert Insights

Passive components can go rogue beyond expected frequencies, resulting in parasitic effects sabotaging EMI suppression. Designers beware, a passive component's non-ideal behavior requires strategic handling.

Often overlooked during the development of appropriate spacings (creepage distances) for safety-certified products is the failure to account accurately for the material group of the components involved. This oversight can have significant implications. Let us briefly explore this issue to raise awareness among readers.

While many designers attempt to perform radiated emissions troubleshooting at an outdoor site or in a semi-anechoic chamber using a third-party test lab facility, I've found a much more efficient method is to perform this using a nearby antenna right on your own work bench.

In this article, we investigate the impact of a guard trace on crosstalk reduction and present measurements taken with the latest‑generation PCB, both in time and frequency domains.

Uncover the crucial role of LISNs - the unsung heroes ensuring reliable electromagnetic testing in aerospace. This insider look reveals their ingenious design and why standardization matters for replicable results.

A differential probe is an active device used to take measurements of certain circuit elements of electronic devices. They are most often used in conjunction with an oscilloscope. Key features and applications of differential probes are summarized in this article.

You know that feeling when a capacitor’s datasheet claims one thing, but NRTL’s online certification directory tells a different story? This blog is all about that - specifically a capacitor rated X1 and Y1, but the certification directory only showed X1. Moral of the story? Double check those certs early in the game to avoid delays.

Ken Wyatt explores a more advanced troubleshooting tool for assessing radiated emission issues, the RF current probe. These are most useful for measuring RF common mode harmonic currents on cables.

This article is the first of a two-article series devoted to the topic of crosstalk between PCB traces. In Part 1 of the series, we vary circuit topology, i.e., the distance between traces and the distance to the ground plane.

The article discusses ESD protection challenges for RF switches in SOI technology. It examines the self-protection mechanism, proposes a behavioral model to simulate ESD response more accurately, and explores predicting failure current levels critical for reliable ESD design.