Columns

Spacecraft now and of the future are being controlled by EMC requirements of the past.

This is the second of the three articles devoted to the topic of a Smith Chart.

As long as integrated circuits migrate to new technologies and advances are made in packaging more integrated circuit dies into a single package, the CDM challenge is going to get harder.

In this column, we discuss several important features of a spectrum analyzer not covered in previous articles that are worth your consideration.

This is the first of the three articles devoted to the Smith Chart and the calculations of the input impedance to a lossless transmission line.

It is a common misconception that designing an IC for system-level ESD requirements simply requires an increase in the capability of the ESD cells, which are already present for safe handling ESD requirements, like Human Body Model (HBM).

This column covers specifics on symbol use – one of the fundamental elements of your labels – and options for handling complexities you may be facing.

This experiment investigates the susceptibility of an ECG machine to emissions from unintentional emitters such as Gameboy™, iPod Nano™, and more.

This is the third of the three tutorial articles devoted to the frequency-domain analysis of a lossless transmission line.

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.