Industry News

Pasternack, an Infinite Electronics brand and a leading provider of RF, microwave and millimeter-wave products, has announced the launch of its new series of high-power RF terminations. They are designed for use in telecommunications, broadcasting, satellite communications and other high-frequency applications where reliable signal termination is essential.

The new Siglent Four Channel SPD4000X DC Power Supplies offer higher power and more channels to support expanded scientific, test, and industrial applications.

Würth Elektronik is expanding its portfolio of digital isolators with a two-channel version in SOIC 8WB package (5.85 x 11.5 x 2.8 mm).

Rohde & Schwarz has successfully validated mission-critical push-to-talk protocol conformance test cases for the Global Certification Forum (GCF) and achieved Test Platform Approval Criteria (TPAC) for its R&S TS‑PCT protocol conformance tester.

The reference book “Trilogy of Wireless Power Transfer” by Würth Elektronik is now available in a revised second edition.

TDK Corporation successfully developed a material for CeraCharge, a next-generation solid-state battery with an energy density of 1,000 Wh/L, approximately 100 times greater than the energy density of TDK’s conventional solid-state battery.

ETS-Lindgren, the global leader in over-the-air (OTA) performance testing, and Anritsu, a pioneer in telecommunications testing technology, are pleased to announce test support for devices using Narrow Band NTN (NB-NTN) protocol.

TÜV Rheinland North America proudly announces the grand opening of its Northeast Technology and Innovation Center located in Boxborough, MA. This advanced facility represents a significant investment for the leading company.

The United States Department of Commerce will provide funding to promote the deployment of open networks in the U.S. and abroad. Rohde & Schwarz and VIAVI offer joint test solutions to meet the needs of radio equipment manufacturers who plan to apply for the funding.

ASMPT combines high-speed chip assembly directly from the wafer with SMT placement in a single machine.