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Industry News

Würth Elektronik Expands its Range of Digital Isolators

Würth Elektronik is expanding its portfolio of digital isolators with a two-channel version in SOIC 8WB package (5.85 x 11.5 x 2.8 mm).

Rohde & Schwarz Leads in Device Conformance for 3GPP Mission Critical Services

Rohde & Schwarz has successfully validated mission-critical push-to-talk protocol conformance test cases for the Global Certification Forum (GCF) and achieved Test Platform Approval Criteria (TPAC) for its R&S TS‑PCT protocol conformance tester.

Würth Elektronik Revises “Trilogy of Wireless Power Transfer”

The reference book “Trilogy of Wireless Power Transfer” by Würth Elektronik is now available in a revised second edition.

TDK Successfully Develops a Material for Solid-State Batteries with 100-times Higher Energy Density

TDK Corporation successfully developed a material for CeraCharge, a next-generation solid-state battery with an energy density of 1,000 Wh/L, approximately 100 times greater than the energy density of TDK’s conventional solid-state battery.

ETS-Lindgren and Anritsu Collaborate to Advance Non-Terrestrial Network (NTN) Device Testing

ETS-Lindgren, the global leader in over-the-air (OTA) performance testing, and Anritsu, a pioneer in telecommunications testing technology, are pleased to announce test support for devices using Narrow Band NTN (NB-NTN) protocol.
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TÜV Rheinland Announces the Grand Opening of Its State-of-the-art Technology and Innovation Center in Boxborough, MA

TÜV Rheinland North America proudly announces the grand opening of its Northeast Technology and Innovation Center located in Boxborough, MA. This advanced facility represents a significant investment for the leading company.

Rohde & Schwarz and VIAVI Offer Joint Network Test Solutions

The United States Department of Commerce will provide funding to promote the deployment of open networks in the U.S. and abroad. Rohde & Schwarz and VIAVI offer joint test solutions to meet the needs of radio equipment manufacturers who plan to apply for the funding.

Two Worlds, One Machine: Semiconductor and SMT Production in a Single Machine

ASMPT combines high-speed chip assembly directly from the wafer with SMT placement in a single machine.

USB-IF Approves USB 3.2 Gen 1 & Gen 2 Transmitter and Receiver Compliance Testing

The USB Implementers Forum (USB-IF) has approved the USB 3.2 Gen 1 & Gen 2 transmitter and receiver compliance test solution from Rohde & Schwarz, confirming that it meets the stringent requirements set by the standardization body.

High-Power S-Band Pulsed Transmitter

Empower RF Systems is proud to announce the launch of the Model 2254 S-Band Pulsed Transmitter.
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