Columns

This is the third and final article discussing four different circuit models of transmission lines in sinusoidal steady state. This article uses Model 4 to determine the locations of the minima and maxima of standing waves. This determination is first done analytically, followed by the graphical method using the Smith chart.

This column explores the significant impact of artificial intelligence on advancements in silicon fabrication, focusing on the development of high bandwidth memory (HBM) and associated die-to-die(D2D) electrostatic discharge (ESD) protection challenges.

This column continues a series on transmission line circuit models, exploring two additional models. It derives equations for voltage characteristics and standing waves, building upon concepts introduced in the previous installment.

This column explores the application of machine learning techniques in ESD compact modeling for semiconductor devices. It compares traditional methods with a new machine learning approach, highlighting improved efficiency and accuracy in predicting ESD protection performance.

This Column discusses a technique for troubleshooting radiated immunity failures in electronic devices using near-field probes. It presents a case study, explains the method's application, and addresses its limitations and safety considerations for bench-level testing.

The month's Banana Skins covers various electromagnetic interference issues in different contexts. It discusses problems with video projectors affecting audio induction loops, switch-mode power supply emissions varying with voltage, hybrid vehicle EM emissions, computer interference with amateur radio, electrostatic discharge in fluid lines, and communication equipment in ambulances causing radio interference.

This article discusses two of four circuit models for transmission lines in sinusoidal steady state. Model 1 is used for solving equations, while Model 2 introduces standing waves. The author explains their applications and differences.

This text discusses ESD/ESA control in semiconductor fabs, highlighting challenges with S20.20 certification, the importance of grounding conductive materials, managing insulative materials, and using ionization for charge neutralization in wafer manufacturing processes.

This column discusses "wordless" safety labels, which use symbols and hazard severity panels without text. It explores their benefits, limitations, and implementation considerations, emphasizing the importance of balancing complete information with clear communication in product safety warnings.

This article explains how to use a Smith Chart to determine the voltage standing wave ratio (VSWR).