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ARRL Files Comments in Response to U.S. FCC’s Deregulation Plans

The National Association for Amateur Radio (the ARRL) has filed comments with the U.S. Federal Communications Commission (FCC) in response to its request for input on reducing or eliminating unnecessary regulatory requirements.

NIST Updates Privacy Framework for Cybersecurity

The U.S. National Institute of Standards and Technology (NIST) has released an updated version of its Privacy Framework in an effort to better align it with its Cybersecurity Guidelines.

T-Mobile to Test Nokia’s 6G Equipment

U.S. cellular service provider T-Mobile has reportedly received permission from the U.S. Federal Communications Commission (FCC) to conduct experimental testing of equipment using 6G technology.

EU Sets Plan to Become Global Leader in AI Technology

As the world actively explores the potential benefits of the application and uses of artificial intelligence (AI), the European Union (EU) is taking action to position itself as the leading global AI player.

Advanced Test Equipment Corporation to Host San Diego Test Equipment Symposium 2025

Advanced Test Equipment Corporation is proud to announce its annual San Diego Test Equipment Symposium (SDTES). This premier industry event will bring together engineers, technicians, and compliance professionals to explore the latest advancements in test technology.
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EMC and Wireless Industry Standards Addressed at May Meeting Series of ANSC C63®

Active technical contributors to the American National Standards Committee (ANSC) C63 (Electromagnetic Compatibility) will meet in person at TÜV Rheinland in Boxborough, Massachusetts, the week of May 5, 2025.

Würth Elektronik Expands its Range of Inductors

Würth Elektronik introduced its new molded flat-wire inductor. The compact inductor measures just 2.0 × 1.6 × 1.0 mm in its smallest package. It also impresses with an exceptionally low resistance and more.

TDK Offers MLCCs with the Industry’s Highest Capacitance at 100V for Automotive Applications

TDK Corporation has expanded its CGA series for automotive multilayer ceramic capacitors (MLCCs) to 10 µF at 100 V in 3225 size, with X7R characteristics (Class Ⅱ dielectric).

FCC Issues Limited Delay in TCPA Implementation

The U.S. Federal Communications Commission (FCC) has temporarily delayed the implementation of a key aspect of its robocall consent requirements to give affected parties more time to modify their existing communications systems.

Siemens Acquires DownStream Technologies to Expand PCB Design-to-Manufacturing Flow

Siemens Digital Industries Software announced today that it has completed the acquisition of DownStream Technologies, a leading provider of manufacturing data preparation solutions for printed circuit board (PCB) design. This acquisition strengthens Siemens’ PCB design portfolio and expands its footprint in the electronics small and medium-sized business (SMB) market.
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