Get our free email newsletter

Magazine

Four Useful Tips for Using Affordable Benchtop Spectrum Analyzers

In this column, we discuss several important features of a spectrum analyzer not covered in previous articles that are worth your consideration.

Questions to Ask When Looking for an EMC Immunity Antenna

Antennas come in many different types, and it can sometimes be overwhelming to decide which one fits the need the best. In the case of immunity antennas, the correct selection may be the difference of reaching field and not. The antenna is the most important part of the system. Given that the amplifiers can be the costliest part of the system, one needs to take the time to research and find the correct antenna to make the best use of the available power.

Smith Chart and Input Impedance to Transmission Line, Part 1: Basic Concepts

This is the first of the three articles devoted to the Smith Chart and the calculations of the input impedance to a lossless transmission line.

Challenges of Designing System-level ESD Protection at the IC Level, Part 2

It is a common misconception that designing an IC for system-level ESD requirements simply requires an increase in the capability of the ESD cells, which are already present for safe handling ESD requirements, like Human Body Model (HBM).

Deciphering Safety Symbol Complexities

This column covers specifics on symbol use – one of the fundamental elements of your labels – and options for handling complexities you may be facing.
- From Our Sponsors -

Banana Skins – April 2023 (#422-423)

This experiment investigates the susceptibility of an ECG machine to emissions from unintentional emitters such as Gameboy™, iPod Nano™, and more.

Why it is Important to Control and Measure CDN Impedance per IEC 61000-4-6

Introduction IEC 61000-4-6 is titled “Electromagnetic compatibility (EMC) - Part 4-6: Testing and measurement techniques...

Sinusoidal Steady State Analysis of Transmission Lines

This is the third of the three tutorial articles devoted to the frequency-domain analysis of a lossless transmission line.

ESD Challenges in 2.5D/3D Integration

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.

Banana Skins – March 2023 (#417-421)

417.  Mains harmonic distortion from electronic equipment upsets energy providers  The increasing use of electronic...
- From Our Sponsors -

Digital Sponsors

Become a Sponsor

Discover new products, review technical whitepapers, read the latest compliance news, and check out trending engineering news.

Get our email updates

What's New

- From Our Sponsors -

Sign up for the In Compliance Email Newsletter

Discover new products, review technical whitepapers, read the latest compliance news, and trending engineering news.