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Characterization for ESD Design, the TLP Zoo: Part 1

Author’s Note: This is the first of a two-part series on the TLP Zoo,...

The Synergy of Filtering and Shielding

This article briefly describes the concept of the synergy of filtering and shielding and why knowing it is important.

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the eighth article in a series of articles devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters and employ different ground techniques [1-7].

A Recipe for Success: How to Grow from EMC Novice to EMC Expert

For engineers new to the field of EMC, the road can look very steep indeed. But, with a plan (and some work!), you can grow from EMC novice to EMC expert.

What Are External Latch-up and Internal Latch-up?

Overall, latch-up prevention is one of the most important tasks for both foundries and IC designers. Based on the chip design scheme, designers should select proper solutions to eliminate the ILU and ELU risks in chip design, referencing the foundry guidelines and latch-up silicon data to ensure minimal latch-up risks for the product. 
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Product Safety and Liability: A Historical Overview

History is very telling in influencing the trajectories of product safety and liability. To get the details, we turned to insight from Doug Nix, Managing Director of Compliance inSight Consulting and lead author of the Machinery Safety 101 blog. Read the interview with Nix for context on how the past has shaped the ideology and approaches that we employ today.

Banana Skins – January 2022 (#358-364)

Operating my personal document shredder crashes my digital TV set-top box, although it is 5 metres away. Toggling the on/off button on the set-top box restores normal operation. 

Power Amplifier Linearity Requirements per IEC 61000-4-3

Introduction The 2020 edition of IEC 61000-4-3 contains several significant technical changes. According to the...

Evaluation of EMC Emissions and Ground Techniques on 1- and 2-layer PCBs with Power Converters

This is the seventh column in a series devoted to the design, test, and EMC emissions evaluation of 1- and 2-layer PCBs that contain AC/DC and/or DC/DC converters, and employ different ground techniques .

Use of HBM and CDM Layout Simulation Tools

The methodology of the state of the art of HBM and CDM layout simulations tools is described. Two real-life case studies are presented briefly and the outlook towards future developments is discussed.
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