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Smith Chart and Input Impedance to Transmission Line

This is the second of the three articles devoted to the topic of a Smith Chart.

Updated Trends in Charge Device Model (CDM)

As long as integrated circuits migrate to new technologies and advances are made in packaging more integrated circuit dies into a single package, the CDM challenge is going to get harder.

Four Useful Tips for Using Affordable Benchtop Spectrum Analyzers

In this column, we discuss several important features of a spectrum analyzer not covered in previous articles that are worth your consideration.

Smith Chart and Input Impedance to Transmission Line, Part 1: Basic Concepts

This is the first of the three articles devoted to the Smith Chart and the calculations of the input impedance to a lossless transmission line.

Challenges of Designing System-level ESD Protection at the IC Level, Part 2

It is a common misconception that designing an IC for system-level ESD requirements simply requires an increase in the capability of the ESD cells, which are already present for safe handling ESD requirements, like Human Body Model (HBM).
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Deciphering Safety Symbol Complexities

This column covers specifics on symbol use – one of the fundamental elements of your labels – and options for handling complexities you may be facing.

Banana Skins – April 2023 (#422-423)

This experiment investigates the susceptibility of an ECG machine to emissions from unintentional emitters such as Gameboy™, iPod Nano™, and more.

Sinusoidal Steady State Analysis of Transmission Lines

This is the third of the three tutorial articles devoted to the frequency-domain analysis of a lossless transmission line.

ESD Challenges in 2.5D/3D Integration

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.

Banana Skins – March 2023 (#417-421)

417.  Mains harmonic distortion from electronic equipment upsets energy providers  The increasing use of electronic...
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