Hot Topics in ESD

Updated Trends in Charge Device Model (CDM)

As long as integrated circuits migrate to new technologies and advances are made in packaging more integrated circuit dies into a single package, the CDM challenge is going to get harder.

ESD Challenges in 2.5D/3D Integration

2.5D/3D integration is an Integrated Circuit (IC) packaging technique that allows the combination of dies of the same or different technologies in the same IC package.

Industry Council’s Latch‑up Survey

This article provides a high-level overview of the Industry Council paper “Survey on Latch‑up Testing Practices and Recommendations for Improvements,” which describes the full analysis of the collected responses and lays a path for potential adaptations needed to accommodate its use in future technologies and applications.