Columns

Ever wonder how accurate your capacitor measurements really are? This deep dive into network analyzer techniques compares three different methods for measuring impedance, uncovering surprising limitations in standard s₁₁ parameter approaches that engineers should know about.

Why do you get zapped touching a doorknob? Dive into the science of static electricity, from atomic-level charge separation to the surprising role of humidity. This practical guide reveals how static builds up and what it means for protecting sensitive electronics.

Got a noisy power system? This real-world EMI investigation reveals how seemingly minor grounding issues between compartments can create major interference problems - and shows how smart measurement techniques led to an elegant fix.

Discover how a unique collaboration between Grand Valley State University and E3 Compliance creates exceptional learning opportunities in EMC and high-speed electronics. Learn how students gain hands-on industry experience through co-op programs, research projects, and real-world testing, preparing them for successful careers in electromagnetic compatibility.

Explore innovations in transistor scaling technology with a focus on backside power delivery networks. This technical analysis examines how extremely thinned silicon substrates impact ESD protection in advanced semiconductor devices, offering solutions for maintaining reliability in next-generation chip designs.

This is the third and final article discussing four different circuit models of transmission lines in sinusoidal steady state. This article uses Model 4 to determine the locations of the minima and maxima of standing waves. This determination is first done analytically, followed by the graphical method using the Smith chart.

This column explores the significant impact of artificial intelligence on advancements in silicon fabrication, focusing on the development of high bandwidth memory (HBM) and associated die-to-die(D2D) electrostatic discharge (ESD) protection challenges.

This column continues a series on transmission line circuit models, exploring two additional models. It derives equations for voltage characteristics and standing waves, building upon concepts introduced in the previous installment.

This column explores the application of machine learning techniques in ESD compact modeling for semiconductor devices. It compares traditional methods with a new machine learning approach, highlighting improved efficiency and accuracy in predicting ESD protection performance.

This Column discusses a technique for troubleshooting radiated immunity failures in electronic devices using near-field probes. It presents a case study, explains the method's application, and addresses its limitations and safety considerations for bench-level testing.